Menu
https://www.thal-technologies.com/en/liquid-non-curing-silicone-thermal-conductive-putty/a3875
Search
 
Previous article Show list Next article
{canonicalURL}
Article number FD23

Liquid non-curing silicone thermal conductive putty

Description
Attachments

FD23 is a single-part, silicone-based thermal gap filler that is soft. The thermal conductive fillers show low abrasion when dispensing which helps to have minimum wear in dispensing equipment.

FD23 is ideal for applications where large or uneven gap tolerances are present.

The soft and compliant nature of this material allows for optimum heattransfer with little to no pressure on mating parts.

FD23 provides excellent thermal performance and compliance. Ideal to use in automatic application for high volume production.

Category: Thermal Gap Filler Putties

3875_20200102153643_Datasheet_FD23.pdf F23 Silicone gel
| Sitemap | Copyright © 2017 Thal Technologies