Liquid non-curing silicone thermal conductive putty

FD37 is a single part dispensable material designed for automation and vertical stability in mind.

FD37 is ideal for applications that can benefit from automation, and allows minimization of pressure on mating surfaces in applications with gap variability.

In addition to providing application flexibility and variable gap adaption, FD37 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer.

Category: Thermal Gap Filler Putties