Article number FD23

Liquid non-curing silicone thermal conductive putty


FD23 is a single-part, silicone-based thermal gap filler that is soft. The thermal conductive fillers show low abrasion when dispensing which helps to have minimum wear in dispensing equipment.

FD23 is ideal for applications where large or uneven gap tolerances are present.

The soft and compliant nature of this material allows for optimum heattransfer with little to no pressure on mating parts.

FD23 provides excellent thermal performance and compliance. Ideal to use in automatic application for high volume production.

Category: Thermal Gap Filler Putties

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